Hot Melt Adhesives
Hot melt adhesives are solid adhesives that are heated beyond their melting point before being applied to a substrate. Depending on the desired use, hot melts have a vast array of appearance and texture. They do not require a curing or drying period as they set quickly while they cool to their point of solidification. Due to this, hot melts are commonly found on automated manufacturing lines that depend upon a quick bond formation.
As an adhesives manufacturer, Technical Adhesives has invested in manufacturing and extrusion equipment to ensure our adhesives are not only clean in appearance but are also the cleanest product available for your application equipment.
Selecting the right hot melt adhesive is important, as the adhesive needed to complete a task can vary greatly. The most common hot melts are EVA (ethylene vinyl acetate), metallocene, polyethylene, APAO (Amorphous Poly Alpha Olefins), and PSA (pressure-sensitive adhesives).
EVA: One of the oldest technologies for hot melt applications. Because of this, there is an enormous number of raw materials available to formulate with. EVA hot melts are petroleum-based, and pricing is highly competitive.
Metallocene: The newest technology in hot melt adhesives that was introduced for the packaging market. Although not as versatile as an EVA based hot melt, it will provide both hot and cold resistance in one formulation. This technology will provide a char free environment for dispensing equipment.
APAO: APAO hot melt adhesives are often used when an EVA hot melt cannot meet all requirements. APAO technology will provide an extended open time as well as extreme temperature conditions. Typically used in automotive applications and specialty assembly applications.
PSA: Rubber based technology that provides unlimited residual tack. Label stock manufacturing, automotive assembly, high-speed bottle labeling, and custom applications come to the forefront for this technology.
Is your hot melt causing you issues? Find out how to prevent the most common issue.